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No. Item Capability
1 No.of Layer層數 2—22Layers
2 Finished Board Size(Max)完成板尺寸(最大) 23″×32″(584mm×813mm)
3 Finished Board Size(Min)完成板尺寸(最小) 3.0″×2.0″ (76mm×51mm)
4 Board Thickness(Max)板厚度(最大) 0.126″(3.2mm)
5 Board Thickness(Min)板厚度(最小) 0.016 ″(0.4mm)
6 T/C Thickness(Min)芯板厚度(最小) 0.0039″(0.1mm)
7 Finished Board Thickness Tolerance成品厚度公差
(Board Thickness≥0.8mm) (板厚≥0.8mm)
±10%
8 Finished Board Thickness Tolerance成品厚度公差
(0.4mm≤Board Thickness<0.8mm) (0.4mm≤板厚<0.8mm)
±3mil(±0.075mm)
9 Warpage(Max)板曲(最大) ≤0.7%
10 Drilling Hole Diameter(Max)鉆孔孔徑(最大) Φ0.252″(6.4mm)
11 Drilling Hole Diameter(Min)鉆孔孔徑(最小) Φ0.0079″(0.20mm)
12 Finished Hole Diameter(Min)完成孔孔徑(最小) Φ0.004 ″(0.10mm)
13 Base Copper Thickness of Outer Layer(Min)
外層底銅厚度(最小)
1/3 OZ (0.012mm)
14 Base Copper Thickness of Outer Layer(Max)
外層底銅厚度(最大)
5 OZ (0.175mm)
15 Base Copper Thickness of Inner Layer(Min)
內層底銅厚度(最小)
1/2 OZ (0.017mm)
16 Base Copper Thickness of Inner Layer(Max)
內層底銅厚度(最大)
5 oz (0.175mm)
17 Dielectric Thickness of Inner Layer(Min)
絕緣層厚度(最小)
0.0030″ (0.076mm)
18 Type of Base Material板料類型 CEM-3;FR-4 (130Tg℃);
FR-4 (140Tg℃);FR-4 (170Tg℃)
19 Aspect Ratio of Plated Hole(Max)
孔電鍍縱橫比(最大)
8:1
20 Hole Diameter Tolerance(PTH)孔徑公差(鍍通孔) ±3mil(±0.076mm)
21 Hole Diameter Tolerance(NPTH)孔徑公差(非鍍通孔) ±2mil(±0.051mm)
22 Hole Position Tolerance(Compared with CAD data)
孔位公差(與CAD數相比)
±3mil(±0.076mm)
23 Copper Thickness of PTH Wall(SMOBC)孔壁銅厚 ≥0.8mil(≥0.020mm)
24 Design Line Width/Space of Outer Layer(Min)
外層設計線寬/間距(最小)
T/TOZ 3.5mil/3.5mil    (0.089mm/0.089mm)
H/HOZ 3.5mil/3.5mil    (0.089mm/0.089mm)
1/1OZ 4mil/4mil        (0.102mm/0.102mm)
2/2OZ 5mil/5mil        (0.127mm/0.127mm)
3/3OZ 6mil/6mil        (0.152mm/0.152mm)
25 Design Line Width/Space of Inner Layer(Min)
內層設計線寬/間距(最小)
H/HOZ 3mil/3mil        (0.076mm/0.076mm)
1/1OZ 4mil/4mil        (0.102mm/0.102mm)
2/2OZ 5mil/5mil        (0.127mm/0.127mm)
3/3OZ 6mil/6mil        (0.152mm/0.152mm)
5/5OZ 9mil/9mil        (0.229mm/0.229mm)
26 Tolerance After Etching
蝕刻公差
±20%(Base Copper H/H oz)
±20%(Base Copper 1/1 oz)
27 Impedance Tolerance of Inner/Outer Layer
內外層阻抗公差
±10%(Base Copper >50Ω)
±5Ω(Base Copper ≤50Ω)
28 Pattern to Pattern Tolerance(Min)
圖形對圖形精度(最小)
±5mil(±0.127mm)
29 Pattern to Hole Tolerance(Min)
外層圖形對孔位精度(最小)
±4mil(±0.102mm)
30 Pattern to Outline(Outer Layers)(Min)
外層圖形對板邊精度(最小)
±6mil(±0.152mm)
31 Pattern to Outline(Inner Layers)(Min)
內層圖形對板邊精度(最小)
±10mil(±0.254mm)
32 Hole to Hole Tolerance(Min)
孔位對孔位精度(最小)
±2mil(±0.05mm)
33 The Minimum Spacing(Hole to Hole)
孔與孔間最小距離(保證不破孔)
12mil
34 Hole to Outline Tolerance(Min)
孔位對板邊精度(最小)
Φd<1.0mm ±8mil(±0.204mm)
±6mil(±0.152mm)
Φd≥1.0mm
35 Solder Mask Registration阻焊對位精度公差 ±2mil
36 Solder Mask Thickness(Min)阻焊厚度 ≥10μm
37 Solder Dam (Min)阻焊橋寬(最小) 3mil(0.076mm)
38 Diameter of Solder Mask Plugging Hole 阻焊塞孔孔徑 >0.75mm(Solder In Hole)
0.55-0.75mm(Solder Ball On Single Side)
<0.55mm(No Solder Ball)
39 Legend Line Width 字符線寬 4mil
40 Legend height and width (on the circuit)
字符高度和寬度(位于線路上時)
height:25mil(0.635mm)
Width:15mil(0.381mm)
41 Legend height and width (on the big area of copper or lamination)字符高度和寬度(位于大銅面或大基材區上時) height:22mil(0.559mm)
Width:13mil(0.330mm)
42 Legend Registration字符對位精度公差 4mil(0.102mm)
43 Legend Line Width (Min)of Solder Mask Opening
綠油開窗文字寬度(最小)
5mil(0.127mm)
44 Nickel Thickness for Immersion Gold (Measured at the Minimum Point)
沉鎳/金之鎳厚(最薄點)
102-200 uin (2.54-5 μm)
45 Gold Thickness for Immersion Gold (Measured at the Minimum Point)
沉鎳/金之金厚(最薄點)
1-4 uin(0.0254-0.102 μm)
46 Silver Thickness for Immersion Silver (Measured at the Minimum Point)
沉銀之銀厚(最薄點)
6-12 uin(0.15-0.3 μm)
47 Tin Thickness for HASL 錫厚(熱風整平) 20-1600 uin(0.5-40 μm)
48 Tin Thickness for Immersion Tin (Measured at the Minimum Point)
沉錫之錫厚(最薄點)
31.5-48 uin(0.8-1.2 μm)
49 Thickness for OSP(Measured at the Minimum Point)
抗氧化膜厚(最薄點)
8-12 uin (0.2-0.3 μm)
50 Carbon Ink Resistance碳油方阻 20Ω/square
51 Carbon conductor Spacing(Min)碳油間距(最小) 15mil(0.381mm)
52 Punching Tolerance (Edge to Edge)(Min)(For Laminate CEM-3 Series)
沖外形公差(邊到邊)(最小)(CEM-X系列)
±6mil(±0.152mm)
53 Punching Tolerance (Hole to Edge )(Min)(For Laminate CEM-3 Series)
沖外形公差(孔到邊)(最小)(CEM-X系列)
±5mil(±0.127mm)
54 Punching Tolerance (Edge to Edge )(Min)(For Laminate FR-4 Series)
沖外形公差(邊到邊)(最小)(FR-X系列)
±8mil(±0.203mm)
55 Punching Tolerance (Hole to Edge )(Min)(For Laminate FR-4 Series)
沖外形公差(孔到邊)(最小)(FR-X系列)
±7mil(±0.178mm)
56 Routing Tolerance (Edge to Edge )(Min)
銑外形公差(邊到邊)(最小)
±4mil(±0.102mm)
57 Routing Tolerance (Hole to Edge )(Min)
銑外形公差(孔到邊)(最小)
±4mil(±0.101mm)
58 Radius By Routing (Internal Angle)(Min)
銑外形圓弧(內角)(最小)
≥16mil (0.4mm)
59 Countersink Hole Size (When Top Angle is 165°)(Max)
銑沉頭孔孔徑(當頂角角度為165°)(最大)
0.25″(6.35mm)
60 Slot Width (Min)長槽寬度(最小) 20mil (0.5mm)
61 Slot Tolerance (PTH)(Length≥2×Width+0.15mm)
長槽形狀公差(沉銅)(當長度≥2×寬度+0.15mm)
±4mil(±0.10mm)
62 Slot Tolerance (PTH)(Length<2×Width+0.15mm)
長槽形狀公差(沉銅)(當長度<2×寬度+0.15mm)
±5mil(±0.127mm)
63 Slot Tolerance (NPTH)長槽形狀公差(非沉銅) ±3mil(±0.076mm)
64 Test PAD width(Min)測試焊盤寬度(最小) Flying Probe test(飛針測試):6mil(0.076mm)
Dedicated test(夾具測試):8mil(0.203mm)
65 Line Width for AOI (Min) AOI檢測線寬(最小) 50μm(2mil)
66 Panel Size for AOI(max) AOI板面最大檢測尺寸 620mm×650mm
67 V-Cut Remaining Thickness Tolerance (Min)
V-槽殘厚公差(最小)
±4mil(±0.102mm)
68 V-Cut Angle Tolerance(30°~60°) (Min)
V-槽角度公差(30°~60°)(最小)
±5°
69 V-Cut Misregistration (Min)
V-槽錯位度(最小)
±5mil(±0.127mm)
70 Board Thickness for V-Cut (Min)
V-槽板厚(最小)
24mil(0.6mm)
71 V-Cut to Hole Tolerance(Min)
V-槽對孔公差(最小)
±6mil(±0.150mm)
72 V-Cut to V-Cut Tolerance (Min)
V-槽對V-槽位置公差(最小)
±5mil(±0.127mm)
73 Distance from the V-Cut Line to Board Edge (Max)
V-CUT到板邊的尺寸(最大)
18 inch
74 HDI hole Diameter(min):5mil
HDI板制作,最小孔徑:5mil
4L/6L/8L
1階4層/1階6層/1階8層板
75 Rigid-Flex PCB
軟硬結合印制板
2L/4L/6L/8L
2至8層板
76 主要板料供應商如下(The supplier of main malterial):
ITEQ(聯茂):SHENGYI(生益):NAN YA(南亞):KINGBORD(建滔)
 
   
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